Copper material pressing process
It is commonly used as materials for wiring components, circuits, and cables in electrical appliances.
At Kato Manufacturing Co., Ltd., we use tough pitch copper with reflow tin plating to press parts called lead frames, which support and fix semiconductor elements (semiconductor chips) used in semiconductor packages such as ICs and LSIs, and connect them to external wiring. When pressing the plated copper sheets, due to the material characteristics of having a hard surface and a soft interior, the mold punch is prone to seizing, requiring careful selection of mold materials and lubrication. Additionally, because there are terminal components that resemble centipede legs, as well as numerous burr processing and pilot hole processing of similar thickness to the sheet, special measures are necessary to prevent scrap and punch breakage, and high-level technology is required to meet the quality demands of all holes and terminal parts. 【Characteristics of Tough Pitch Copper】 ○ Copper alloy number: C1100 ○ Composition: Cu 99.90 or higher ○ Tensile strength: 245–315 N/mm² ○ Elongation: 15.0% ○ Hardness: 75.0–120.0 HV For more details, please contact us or download the catalog.
- Company：加藤製作所
- Price：Other
